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  7. ResinTech SACMP-H Cation Exchange Resin, H Form, 1 Cubic Foot
ResinTech SACMP-H Cation Exchange Resin, H Form, 1 Cubic Foot
ResinTech SACMP-H Cation Exchange Resin, H Form, 1 Cubic Foot
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ResinTech SACMP-H Cation Exchange Resin, H Form, 1 Cubic Foot

Part Number: SACMP-H
Your Price: $299.00
Retail Price:$411.00
Your Savings:$112.00(27%)
ResinTech SACMP-H Cation Exchange Resin, H Form, 1 Cubic Foot
Typically Ships in 2-10 Days Free Shipping
Feature: 2055
Quantity Price
1 - 7 $299.00
8 - 41 $276.58
42+ $254.15
ResinTech SACMP-H Cation Exchange Resin, H Form, 1 Cubic Foot

ResinTech SACMP os a sodium form macroporous highly cross linked strong acid cation resin. SACMP is intended for high flow rate and high temperature polishing applications, as well as other applications that require the highest possible physical strength and chemical durability.

Features & Benefits
     - Macroporous Structure: Gives greatly increased life in stressful applications where resin degradation due to thermal and oxidative effects is anticipated
     - Controlled Particle Size: 16 to 50 mesh size provides a low pressure drop and superior kinetics 
     - Superior Physical Stability: 98% plus sphericity and high crush strengths together with carefully controlled particle distribution provides long life and low pressure drop
     - Complies With US FDA Regulations: Conforms to paragraph 21CFR173.25 of the Food Additives Regulations of the US FDA

Applications:
     - Demineralization: ResinTech SACMP-H can be used as the cation component in demineralization configurations where a hydrogen form cation resin is coupled with a hydroxide form anion resin. SACMP-H is ideal for high flow rate polishers and where high resistance to mechanical, thermal and oxidative stresses is required.
     - Radwaste: SACMP is ideally suited for radwaste applications. The high cross linking content of SACMP gives improved resistance to chemical damage caused by ionizing radiation. Structural integrity is maintained up to approximately 1 x 10^9 rads exposure.




  

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